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晶圆制造/代工


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地缘政治风险延烧,美系终端品牌启动去中化策略,带动Foundry转单效应

2022/12/14

晶圆制造/代工

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根据全球市场研究机构集邦科技TrendForce调查表示,在《芯片法案》(The CHIPS+ Act)与美商务部对中最新禁令(New Export Controls)相继颁布并生效后...

Foundry市场快讯_20221212

2022/12/12

晶圆制造/代工

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关于TSMC Arizona Fab21,呈TrendForce于2022/11/14出刊的market bulletin当中提及,该厂共规划六期(phase)...

Overview of Semiconductor Subsidy Policies

2022/12/09

晶圆制造/代工

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1. European Chips Act
2. US Subsidy Policies
3. Japan Subsidy Policies
4. Partnership between Japan and the US
5. LSTC
6. Cooperation Framework and Organization of Rapidus
7. Strategy for Future Development and Cooperation
8. Conclusion

Overview of Semiconductor Subsidy Policies

2022/12/09

晶圆制造/代工

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1. European Chips Act
2. US Subsidy Policies
3. Japan Subsidy Policies
4. Partnership between Japan and the US
5. LSTC
6. Cooperation Framework and Organization of Rapidus
7. Strategy for Future Development and Cooperation
8. Conclusion

iPhone新机带动3Q22前十大晶圆代工产值季增6%,惟产值已攀顶峰下行风暴将至

2022/12/05

晶圆制造/代工

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根据全球市场研究机构集邦科技TrendForce调查显示,随着供应链进入库存修正期,终端及芯片厂目标将库存消化至疫情前健康水位...

Foundry市场快讯_20221128

2022/11/28

晶圆制造/代工

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从资本支出观察,在目前晶圆代工需求转弱的市况下,Samsung Foundry在2023年规划约US$14-15bn资本支出预算,仍较2022年成长...

Foundry市场快讯_20221114

2022/11/14

晶圆制造/代工

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关于TSMC Arizona Fab21,如同TrendForce于2021/2/8及2021/3/8出刊的market bulletin当中提及,该厂区占地超过1,100英亩...

Nexchip强势扩产,台系二三线Foundry承压;惟美禁令仍为最大变因

2022/11/03

晶圆制造/代工

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根据全球市场研究机构集邦科技TrendForce调查表示,地缘政治因素使得「短链生产」或区域生产议题受到关注,尤其近期中美贸易冲突升温...

Foundry市场快讯_20221031

2022/10/31

晶圆制造/代工

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Samsung foundry 3Q22营收若以韩圜计算,3Q22营收仍较前季增6.3%,不过若以美元基础换算,3Q22营收为...

Foundry市场快讯_20221017

2022/10/17

晶圆制造/代工

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TSMC 3Q22营收为US$20.23bn (NT$613.14bn,以台币兑美元汇率30.32为基准),受惠于优于预期的美元汇率、强劲的5nm需求与晶圆出货量增加等因素...